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NZL5V6AXV3T1 Series
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR?5 Board (Note 1) @ T A = 25 ° C
Derate above 25 ° C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature Range
Lead Solder Temperature ? Maximum (10 Second Duration)
IEC61000?4?2 (Contact)
Symbol
° P D °
R q JA
T J , T stg
T L
Value
240
1.9
525
?55 to +150
260
10
Unit
° mW °
mW/ ° C
° C/W
° C
° C
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. FR?5 board with minimum recommended mounting pad.
*Other voltages may be available upon request.
ELECTRICAL CHARACTERISTICS
(T A = 25 ° C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
Parameter
V RWM
Working Peak Reverse Voltage
I F
I
I R
V BR
Maximum Reverse Leakage Current @ V RWM
Breakdown Voltage @ I T
V C V BR V RWM
I R V F
I T
V
I T
I F
Test Current
Forward Current
V F
Forward Voltage @ I F
I PP
Uni?Directional TVS
ELECTRICAL CHARACTERISTICS (T A = 25 ° C unless otherwise noted, V F = 0.9 V Max @ I F = 10 mA for all types)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
Breakdown Voltage
V C (V) @
Surge
Device
V RWM
I R @
V RWM
V BR (Note 2) (V)
@ Iz T
I PP = 1.0
A ?
V C (V) @
Max I PP ?
Max I PP
(A) ?
P pk
(W) ?
Device
Marking
V
m A
Min
Nom
Max
mA
Typ
Max
Typ
NZL5V6AXV3T1
NZL6V8AXV3T1
NZL6V8AXV3T3
NZL7V5AXV3T1
L0
L2
L2
L3
3.0
4.5
4.5
5.0
5.0
1.0
1.0
1.0
5.32
6.46
6.46
7.12
5.6
6.8
6.8
7.5
5.88
7.14
7.14
7.88
5.0
5.0
5.0
5.0
7.0
7.9
7.9
8.8
10.1
11.9
11.9
13.5
4.8
6.7
6.7
5.7
50
73
73
75
2. V BR measured at pulse test current I T at an ambient temperature of 25 ° C.
? Surge current waveform per Figure 5.
http://onsemi.com
2
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